Intel’s Mix and Match Innovation (Infographic)
![monolithic-chiplets-2x1.jpg](https://dlit.co/wp-content/uploads/2018/09/monolithic-chiplets-2x1-578x246.jpg)
Today, at the annual Hot Chips Conference in Cupertino, California, Intel presented details about the company’s EMIB (Embedded Multi-die Interconnect
Posted on September 20, 2018 by Design in Design Innovation | 0 Comments
Today, at the annual Hot Chips Conference in Cupertino, California, Intel presented details about the company’s EMIB (Embedded Multi-die Interconnect
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